Fully automatic peeling and bonding device
Consultation available for power supply units and clean classes! We can suggest suitable methods for the stripping process.
We would like to introduce our "Fully Automatic Peeling and Bonding Device." This device automatically peels off protective films (separators) and bonds them with high precision for main and sub-works flowing in from upstream. It is capable of simultaneous peeling and bonding on both sides. For heavier peeling forces, please feel free to consult us. 【Reference Specifications (Partial)】 ■ Bonding Position Accuracy: ±0.10mm in X1, Y1 directions ■ Cycle Time: Depends on material, adhesive type, and work size ■ Work Supply: Inline ■ Device Dimensions: L3000mm × W1500mm × H1900mm (including HEPA) ■ Compatible Work Size: Max L300 × 200mm (Maximum size achieved by peeling device: 1550 × 1300mm) * For more details, please refer to the related links or feel free to contact us. ■ Flexible substrates are also supported. ■ Sale of peeling units only is also possible.
- Company：サンテック
- Price：Other
